Strong glue able to withstand higher temperatures.

* 100% New Heatsink plaster.

* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink?High power LED,VGA CARD Northbridge Southbridge Heatsink.

* Features: thermal properties, strong adhesion

* Melting capacity: 0 (200 ? / 24Hours)

* Evaporation: 0.001% (200 ? / 24Hours)

* Thermal conductivity:> 1.2W/m-K

* Thermal Impedance: <0.06

* Clotting time: 3min (25 ?)

* Strength of connected buildings: 25Kg

* Insulation coefficient> 5.1

* Dissipation coefficient <0.005
* Temperature resistance: 200 ?

(Quelle: reprapworld.com)